Microscopic Strain Measurement

Combination of a special stereomicroscope with Vic-3D digital image correlation on electronic components.


Uni Wien Mikroskop

Mea­sure­ment set up: Stereo micro­scope mounted

on x‑y-z-microtable (back­side) and ten­sile machine (right).


Uni Wien Mikroskop2

Uni Wien Mikroskop3

Servered ceram­ic capac­i­tor chip under bend­ing load (image width approx. 4mm):
Strain in x‑direction (upper image) and y- direc­tion (low­er image).


Uni Wien Mikroskop4

Uni Wien Mikroskop5

Stan­dard deriva­tion (upper) under load : An increased val­ue occurs on the mid­dle against the reference
state by the local­ly small bulge at the con­tact between chip and board (see 3D con­ture below). This might be caused
by mate­r­i­al , which is pressed togeth­er between the two parts (includ­ing the colour lay­er). In the upper area the
increased val­ues of the stan­dard deriva­tion is caused by the reduced speck­le density.