Combination Stereomicroscope and Vic-3D digital image correlation

Appli­ca­ti­on examp­les of a spe­cial ste­reo­mic­ro­scope in com­bi­na­ti­on with Vic-3D digi­tal image cor­re­la­ti­on on elec­tro­nic components.


Image 1: Mea­su­re­ment setup

Mea­su­re­ment set up: Ste­reo micro­scope moun­ted on x‑y-z-micro­ta­ble (backside) and ten­si­le machi­ne (right).


Image 2: Strain in x‑direction


Image 3: Strain in y‑direction

Strain dis­tri­bu­ti­on of a half cut capa­ci­tor-chip (left part) and its sold­e­ring area (round sec­tion). The board is under
ben­ding load. The board is ver­ti­cal on the right sight of the image. The local red area is show­ing a crack in the
sold­e­ring part. Image area approx. <2mm.



Image 4: The main strain of mea­su­ring a sold­er ball d=300µm under hori­zon­tal shear stress is shown.


Operation mode analysis on a mobile phone during vibration alert



Refe­rence coor­di­na­tes and con­tour of the mobi­le phone.






This artic­le descri­bes the mea­su­re­ment and ana­ly­sis of the ope­ra­ti­on deflec­tion shapes and rigid body vibra­ti­on moti­ons of a mobi­le pho­ne exci­ted by its vibra­ti­on alert. The mear­ur­e­ment is done, using a non cont­act, 3D, full-field, high speed ste­reo image cor­re­la­ti­on sys­tem in com­bi­na­ti­on with the new Vic-3D FFT modu­le ana­ly­zes the recor­ded defor­ma­ti­on data in the fre­quen­cy domain by pha­se-sepa­ra­ti­on method.


The mea­su­red defor­ma­ti­ons and dis­pla­ce­ments during the vibra­ti­on alert are eva­lua­ted against the refe­rence sta­te for each ste­reo image pair. In this case the recor­ding time covers about 5,5 seconds with 1000 FPS cor­re­spon­ding to about 5500 sin­gle measurements.

The fol­lo­wing figu­re show the avera­ge vibra­ti­on ampli­tu­de U.