Combination Stereomicroscope and Vic-3D digital image correlation

Appli­ca­tion exam­ples of a spe­cial stere­omi­cro­scope in com­bi­na­tion with Vic-3D dig­i­tal image cor­re­la­tion on elec­tron­ic components.

Image 1: Mea­sure­ment setup

Mea­sure­ment set up: Stereo micro­scope mount­ed on x‑y-z-microtable (back­side) and ten­sile machine (right).

Image 2: Strain in x‑direction

Image 3: Strain in y‑direction

Strain dis­tri­b­u­tion of a half cut capac­i­tor-chip (left part) and its sol­der­ing area (round sec­tion). The board is under
bend­ing load. The board is ver­ti­cal on the right sight of the image. The local red area is show­ing a crack in the
sol­der­ing part. Image area approx. <2mm.

 

Image 4: The main strain of mea­sur­ing a sol­der ball d=300µm under hor­i­zon­tal shear stress is shown.