Coupled Thermomechanical Response Measurement of Deformation of a CPU

Full-field Digital Image Correlation (DIC) combined with Infrared Thermography was used to investigate the thermomechanical response of an Intel Itanium 9050 CPU. The synchronized measurement approach provides detailed information about the interaction between temperature changes and mechanical deformation.
The system consisted of two 24 MP cameras at 15 Hz for deformation measurements and a FLIR A655sc infrared camera for thermal analysis.